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Influence of Infill Parameters on the Tensile Mechanical Properties of 3D Printed Parts

Guan et al. | Jul 17, 2020

Influence of Infill Parameters on the Tensile Mechanical Properties of 3D Printed Parts

Manufacturers that produce products using fused filament fabrication (FFF) 3D printing technologies have control of numerous build parameters. This includes the number of solid layers on the exterior of the product, the percentage of material filling the interior volume, and the many different types of infill patterns used to fill their interior.This study investigates the hypothesis that as the density of the part increases, the mechanical properties will improve at the expense of build time and the amount of material required.

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String analysis of exon 10 of the CFTR gene and the use of Bioinformatics in determination of the most accurate DNA indicator for CF prediction

Carroll et al. | Jul 12, 2020

String analysis of exon 10 of the CFTR gene and the use of Bioinformatics in determination of the most accurate DNA indicator for CF prediction

Cystic fibrosis is a genetic disease caused by mutations in the CFTR gene. In this paper, the authors attempt to identify variations in stretches of up to 8 nucleotides in the protein-coding portions of the CFTR gene that are associated with disease development. This would allow screening of newborns or even fetuses in utero to determine the likelihood they develop cystic fibrosis.

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Solubility of graphite and the efficacy of using its dissolved form as a conductive paste

Kirby et al. | Aug 23, 2024

Solubility of graphite and the efficacy of using its dissolved form as a conductive paste

This study explored the use of graphite's conductivity for circuit boards by creating a conductive paste through exfoliation with organic solvents and sonication. The combination of acetone and sonication was found to be the most effective, producing a high-conductivity paste with desirable properties such as a low boiling point. While not a replacement for wires, this conductive paste has potential applications in electronics and infrastructure, provided that key engineering challenges are addressed.

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