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Semiconductors are the center of the fourth industrial revolution as they are key components for all electronics. Exposed wafers made of silicon (Si), which can easily oxidize, convert to silicon dioxide (SiO₂). The surface of SiO₂ wafers consists of many Si-OH bonds, allowing them to easily bond with water, resulting in a “wet” or hydrophilic condition. We sought to determine a way to modify the surface of SiO₂ wafers to become hydrophobic to ensure safe wet cleaning.

The authors test how the size-segregation theory applies to the behavior of hollow and irregular-shaped objects.

In the age of global warming, these authors studied which of the four major greenhouse gases (water vapor, carbon dioxide, and nitrous oxide) change the most with increased temperature.