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Statistical evaluation of the effects of surface processing on aerospace fastener tested strength

Zeng et al. | Mar 31, 2023

Statistical evaluation of the effects of surface processing on aerospace fastener tested strength
Image credit: Robert Ruggiero

In the aerospace industry, various surface processing or coatings are widely used. However, no detailed research on the aerospace fastener tensile and double shear strength variation due to surface processing has been conducted. Thus, the purpose of this study was to systematically evaluate the effect of surface processing on the standard aerospace fastener's tensile and shear properties.

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Investigating toxicity and antimicrobial properties of silver nanoparticles in Escherichia coli and Drosophila melanogaster

Ghosh et al. | Dec 01, 2025

Investigating toxicity and antimicrobial properties of silver nanoparticles in <em>Escherichia coli</em> and <em>Drosophila melanogaster</em>
Image credit: Ghosh and Hendricks

This paper looks at the antibacterial and toxic effects of silver nanoparticles (AgNPs) on Escherichia coli bacteria and Drosophila melanogaster fruit flies. They modified the AgNPs size, concentration, and surface coating to determine the effects on each of the organisms. For both organisms, increased AgNP concentration demonstrated increased toxicity but particle size and surface coating had opposing effects.

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Changing the surface properties of the backside of a silicon wafer to repel oil and prevent particle binding

Choi et al. | Feb 14, 2025

Changing the surface properties of the backside of a silicon wafer to repel oil and prevent particle binding

Wafers, essential in microchip production, can develop issues like leveling problems and wafer slip due to the formation of silanol bonds on their backside, which attract silica particles and oil. Authors tested addressing this issue with a coating of [acetoxy(polyethyleneoxy)propyl]triethoxysilane (APTS) applied to the wafer’s backside, preventing particle binding and oil adherence.

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Development of novel biodegradable bioplastics for packaging film using mango peels

Wang et al. | Apr 06, 2025

Development of novel biodegradable bioplastics for packaging film using mango peels
Image credit: JACQUELINE BRANDWAYN

Here the authors explored the development of biodegradable bioplastic films derived from mango peels as a sustainable solution to plastic pollution and greenhouse gas emissions from fruit waste. They optimized the film's mechanical properties and water resistance through adjusting processing conditions and incorporating plasticizers and a hydrophobic coating, ultimately demonstrating its potential as a bacteriostatic and biodegradable alternative to conventional plastic food wrap.

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Converting SiO2 wafers to hydrophobic using chlorotrimethylsilane

Lee et al. | Aug 20, 2024

Converting SiO<sub>2</sub> wafers to hydrophobic using chlorotrimethylsilane

Semiconductors are the center of the fourth industrial revolution as they are key components for all electronics. Exposed wafers made of silicon (Si), which can easily oxidize, convert to silicon dioxide (SiO2). The surface of SiO2 wafers consists of many Si-OH bonds, allowing them to easily bond with water, resulting in a “wet” or hydrophilic condition. We sought to determine a way to modify the surface of SiO2 wafers to become hydrophobic to ensure safe wet cleaning.

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Solubility of graphite and the efficacy of using its dissolved form as a conductive paste

Kirby et al. | Aug 23, 2024

Solubility of graphite and the efficacy of using its dissolved form as a conductive paste

This study explored the use of graphite's conductivity for circuit boards by creating a conductive paste through exfoliation with organic solvents and sonication. The combination of acetone and sonication was found to be the most effective, producing a high-conductivity paste with desirable properties such as a low boiling point. While not a replacement for wires, this conductive paste has potential applications in electronics and infrastructure, provided that key engineering challenges are addressed.

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